Adwill (label)

Adwill (label)

By: Lintec Kabushiki Kaisha Also Trading As Lintec Corporation (a Ja

[class : 7] Semiconductor Manufacturing Machines And Systems; Uv Irradiation Machines For Use In Semiconductor Manufacturing Process; Machines For Adhering Surface Protection Tapes, Machines For Adhering Backside Protection Tape, Both Being For Use In Semiconductor Manufacturing Process; Machines For Releasing Surface Protection Tape, Machines For Releasing Backside Protection Tape, Both Being For Use In Semiconductor Manufacturing Process; Machines For Issuing And Adhering, For Reading, And For Writing Bar Code Label And Radio Frequency Identification (rfid) Label, All Being For Use In Semiconductor Manufacturing Process; Semiconductor Wafer Processing Machines And Parts Thereof; Feeding Machines, Transferring Machines, And Storing Machines, All For Semiconductor Wafers; Machines For Exchanging Wafers Among Semiconductor Wafer Containers; Heating Machines, Pressurizing Machines For Processing Semiconductor Wafers; Frames For Use In Semiconductor Wafer Processing Steps; Storing Containers, Transferring Containers, And Transporting Containers, All For Semiconductor Wafers; Cutting Machines, And Punching Machines, Both Being For Use In Semiconductor Wafer Processing Tapes.[class : 9] Bar Code Printers; Thermal Transfer Printers; Laser Printers; Ink Jet Printers; Thermal Printers; Printers.[class : 16] Ink Ribbons For Printing; Adhesive Coated Paper; Adhesive Labels (not Including Those Made Of Woven Fabrics); Heat-sensitive Adhesive Labels; Bar Code Labels, Rfid Labels; Bar Code Labels, Rfid Labels, Both Being For Physical Distribution Management; Bar Code Labels, Rfid Labels, Both Being For Production Management.[class : 17] Plastic Basic Products; Plastic Films Coated With Adhesives, With Pressure-sensitive Adhesives, And With Adhesives/pressure-sensitive Adhesives; Adhesive Tapes, Pressure-sensitive Adhesive Tapes, Adhesive Tapes/pressure-sensitive Adhesive Tapes, All Being For Processing Semiconductors; Adhesive Tapes, Pressure-sensitive Adhesive Tapes, Adhesive Tapes/pressure-sensitive Adhesive Tapes, All Being For Holding In Position Semiconductors; Processing Tapes For Processing Semiconductor Wafers; Adhesive Tapes For Surface-mounting/laminating Semiconductor Chips; Heat-sensitive And Pressure-sensitive Adhesive Tapes/heat-sensitive Adhesive Tapes For Use In Manufacturing Processes Of Electronic Parts Such As Semiconductor Wafers, Ceramic Capacitors, Etc.; Protection Tapes For Protecting Rear Surfaces Of Semiconductor Chips.