DEVICE

DEVICE

By: Macdermid, Incorporated

[class : 1] Hydraulic Fluids; Pressure Compensating Fluids; Motion Compensating Fluids; Hydraulic Fluids For Subsea Production Control Systems; Well Control Fluids; Subsea Blowout Preventer Control Fluids; Surface Blowout Preventer Control Fluids; Chemicals Used In The Oil And Gas, Exploration And Production Industry; Industrial Chemicals For Use In Plating, Cleaning And Etching Metal And Plastic Surfaces; Chemicals For Use In The Manufacture Of Commercial And Industrial Printing Plates, Namely, Polymer Compositions; Chemicals For Use In Electroless Plating And Electroplating Processes; Chemical Compositions For Metal Plating; Pre-treatment Preparations For Plating; Trivalent Chromate Finishing And Coating Preparations For Plating; Metal Chlorides; Chemicals For Use In Semiconductor Manufacture, Semiconductor Device Fabrication And Semiconductor Packaging; Electroplating Chemicals; Chemicals For Wafer Level Semiconductor Packaging Processes; Chemicals For Panel Level Semiconductor Packaging Processes; Chemicals For Fan Out Wafer Level Semiconductor Packaging Processes; Chemicals For Fan Out Panel Level Semiconductor Packaging Processes; Chemicals For Use In The Circuit Board Industry, Namely, Peroxide And Sulfuric Acid Based Etchants And Oxidants For Roughening Or Etching Copper Surfaces Prior To Multilayer Lamination Of Printed Wiring Boards; Chemicals Used In Industry; Adhesives For Use In Electronics Industry; Non-conductive Adhesives For Use In Electronics Industry; Unprocessed Epoxy Resins For Use In Electronics Industry; Industrial Adhesives Used In The Assembly, Maintenance And Repair Of Electronics For Use In Electronics Industry; Fillers For Use With Electronic Components, Namely, Unprocessed Epoxy Resins For Use As Underfill; Unprocessed Epoxy Resins; Chemicals, Namely, Soldering Flux; Industrial Chemicals Used For Cleaning Circuit Boards And Surface Mount Devices; Industrial Adhesives, Unprocessed Artificial Resins, Unprocessed Synthetic Resins, Unprocessed Epoxy Resins For Bonding, Wetproofing, Coating, Encapsulation, Sealing, Molding, Waterproofing, Moisture Proofing, Heatproofing, Solder Joint Attachment Applications In The Electronics Industry; Chemicals Used In The Cleaning, Etching And Plating Of Metals And Non-metal Substrates; Chemicals Used In The Production Of Printed Circuit Boards And Semiconductor Materials; Industrial Chemicals; Chemical Preparations For Scientific Use (other Than For Medical Or Veterinary Use); Chemicals For Laboratory Analyses (other Than For Medical Or Veterinary Use); Chemical Reagents (other Than For Medical Or Veterinary Use); Compositions For Chemically Modifying Metal And Nonmetal Products; Chemical Used In Activating, Acidification, Coating, Drying, Retouching And Altering Metal And Nonmetal Products; Chemicals Used For Separating Chromium Compounds From Aqueous Solutions.[class : 3] Cleaning Agents.[class : 4] Lubricants.[class : 6] Metal Wire; Silver Solder; Gold Solder; Brazing Alloy; Hard Solder; Metal Rod For Brazing And Welding (including Steel Titanium Alloy); Soft Solder; Solder Preforms; Welding Metal Rod; Tin Wire.[class : 7] Machine For Use In Fabricating Printing Photopolymer Plates, Namely For Ultraviolet Exposure And Imaging Equipment, Infrared Imaging Equipment, Solvent And Thermal Developing Equipment, Detackification Equipment, And Post Exposure Processing Equipment.