TRADEMARK NAME Direct pressed die technology
Direct Pressed Die Technology
Semikron International Gmbh
Direct Pressed Die Technology
By: Semikron International Gmbh
Electronic Components; Power Transformers; Voltage Converters; Voltage Regulators; Semiconductor Devices; Semiconductor Components, Particularly Discrete And Integrated Semiconductor Devices; Transistors, Particularly Bipolar Transistors; Field-effect Transistors And Power Transistors; Diodes, Particularly Power Diodes; Thyristors, Particularly Power Thyristors; Power Semiconductor Modules; Power Semiconductor Modules With Power Semiconductor Components; Power Semiconductor Modules With Pressure Device For Electrical Contacting Of Substrates; Connecting Elements And Power Semiconductor Devices; Power Semiconductor Modules With Printing Devices For Thermal Bonding Of Substrates, Connecting Elements And Power Semiconductor Devices; Unit Converters With Power Semiconductor Modules, With Other Electrical And Electronic Components And Power Converter Systems Built From These Unit Converters.
Suitable industries
Electrical and Scientific Apparatus
Trademark Details
This Brand Name Direct Pressed Die Technology is applied by Semikron International Gmbh
This Trademark was applied on date 26 July 2016
This Application has been filed by their agent CHANDRAKANT M. JOSHI
| Trademark | Direct Pressed Die Technology |
| Application No | 3494424 |
| Filing Dte | 26-07-2016 |
| User Detail | Proposed to be used |
| Certificate Number | 0 |
| Valid Until | |
| Goods and Service | Electronic Components; Power Transformers; Voltage Converters; Voltage Regulators; Semiconductor Devices; Semiconductor Components, Particularly Discrete And Integrated Semiconductor Devices; Transistors, Particularly Bipolar Transistors; Field-effect Transistors And Power Transistors; Diodes, Particularly Power Diodes; Thyristors, Particularly Power Thyristors; Power Semiconductor Modules; Power Semiconductor Modules With Power Semiconductor Components; Power Semiconductor Modules With Pressure Device For Electrical Contacting Of Substrates; Connecting Elements And Power Semiconductor Devices; Power Semiconductor Modules With Printing Devices For Thermal Bonding Of Substrates, Connecting Elements And Power Semiconductor Devices; Unit Converters With Power Semiconductor Modules, With Other Electrical And Electronic Components And Power Converter Systems Built From These Unit Converters. |
| Business Name | Semikron International Gmbh |
| Business Type | Private Limited Company |
| Business Sector | Manufacturing |
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