TRADEMARK NAME Heat-spring
HEAT-SPRING
By: Indium Corporation Of America
Thermally Conductive Metal Foils For Improving Thermal Interfaces Between Semiconductor And Electrical Components
Suitable industries
Metal Goods
Trademark Details
This Brand Name HEAT-SPRING is applied by Indium Corporation Of America
This Trademark was applied on date 08 March 2011
This Application has been filed by their agent REMFRY & SAGAR
| Trademark | HEAT-SPRING |
| Application No | 2111255 |
| Filing Dte | 08-03-2011 |
| User Detail | Proposed to be used |
| Certificate Number | 1841541 |
| Valid Until | 08-03-2031 |
| Goods and Service | Thermally Conductive Metal Foils For Improving Thermal Interfaces Between Semiconductor And Electrical Components |
| Business Name | Indium Corporation Of America |
| Business Type | Private Limited Company |
| Business Sector | Manufacturing |
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