TRADEMARK NAME Hi bond
HI BOND
By: Satnam Mechnical Works.
In Respect Of Agro Based Particle Boards, Wood Free Particle Boards And Allied Products
Trademark Details
This Brand Name HI BOND is applied by Satnam Mechnical Works.
This Trademark was applied on date 18 September 2001
This Application has been filed by their agent None
| Trademark | HI BOND |
| Application No | 1045566 |
| Filing Dte | 18-09-2001 |
| User Detail | Proposed to be used |
| Certificate Number | |
| Valid Until | |
| Goods and Service | In Respect Of Agro Based Particle Boards, Wood Free Particle Boards And Allied Products |
| Business Name | Satnam Mechnical Works. |
| Business Type | PartnerShip firm |
| Business Sector | Manufacturing |
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