HI BOND
By: Hi-bond Infra Private Limited
Cement, Tiles, Building Materials, (non-metallic), Non-metallic Rigid Pipes For Building; Asphalt, Pitch And Bitumen; Non-metallic Transportable Buildings; Monuments, Not Of Metal.
Trademark Details
This Brand Name HI BOND is applied by Hi-bond Infra Private Limited
This Trademark was applied on date 02 March 2012
This Application has been filed by their agent K.C. PATEL & CO.
Trademark | HI BOND |
Application No | 2293862 |
Filing Dte | 02-03-2012 |
User Detail | 01/04/2007 |
Certificate Number | 1851141 |
Valid Until | 02-03-2032 |
Goods and Service | Cement, Tiles, Building Materials, (non-metallic), Non-metallic Rigid Pipes For Building; Asphalt, Pitch And Bitumen; Non-metallic Transportable Buildings; Monuments, Not Of Metal. |
Business Name | Hi-bond Infra Private Limited |
Business Type | Private Limited Company |
Business Sector | Manufacturing |
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