HSP

HSP

By: Taiyo Holdings Co., Ltd.

[class : 1] Chemical Preparations For Use In The Process Of Producing Printed Circuit Boards, Namely, Resist Ink In The Nature Of Solder Mask; Chemical Preparations For Use In The Process Of Producing Printed Circuit Boards, Namely, Resist Ink In The Nature Of Photoresists; Chemical Preparations For Use In The Process Of Producing Printed Circuit Boards, Namely, Solder Resists; Chemical Preparations For Solder Resists Used In The Process Of Producing Printed Circuit Boards; Chemical Preparations For Use In The Process Of Producing Printed Circuit Boards, Namely, Etching Resist; Chemical Preparations For Use In The Process Of Producing Printed Circuit Boards, Namely, Photoresists; Chemical Preparations For Use In Photography; Photosensitive Resists In The Nature Of Solder Mask In The Form Of Film For Use In The Process Of Producing Printed Circuit Boards; Dry Films For Use In The Process Of Producing Electronic Components; Photosensitive Resists In The Form Of Film For Sealing Electronic Components; Thermal-curing-type Dry Films For Use In The Process Of Producing Electronic Components; Dry Films Possessing Electrical Insulation For Use In The Process Of Producing Electronic Components; Chemical Preparations For Blocking Light; Chemical Coatings For Use In The Process Of Producing Printed Circuit Boards; Chemical Preparations For Resisting Heat; Chemical Preparations For Industrial Purposes; Industrial Chemicals; Glue And Adhesives For Industrial Purposes; Synthetic Resin Compositions Possessing Thermal Conductivity For Use In The Process Of Producing Electronic Components.[class : 2] Dyestuffs; Pigments; Marking Inks In The Nature Of Printing Inks For Use In The Process Of Producing Printed Circuit Boards; Marking Inks For Use In The Process Of Producing Electronic Components; Inks For Plugging Hole, Namely, Printing Inks For Use In The Process Of Producing Printed Circuit Boards; Printing Inks For Use In The Process Of Producing Printed Circuit Boards; Printing Inks For Use In The Process Of Producing Electronic Components; Printing Inks, Other Than Mimeographing Inks.[class : 17] Electrical Insulating Resists, Namely, Electrical Insulating Materials In Liquid Form For Use In The Process Of Producing Printed Circuit Boards; Electrical Insulating Materials, Namely, Electrical Insulating Synthetic Resin Materials For Use In The Process Of Producing Printed Circuit Boards; Electrical Insulating Synthetic Resin Materials Possessing Thermal Conductivity For Use In The Process Of Producing Electronic Components; Electrical Insulating Synthetic Resin Materials For Use In The Process Of Producing Electronic Components; Electrical Insulating Synthetic Resin Materials Used For Liquid-form Electrical Insulating Materials Installed In An Interlayer Of Build-up Boards For Use In The Process Of Producing Build-up Boards; Electrical Insulating Synthetic Resin Materials Used For Liquid-form Electrical Insulating Materials Installed In An Interlayer Of Electronic Components For Sealing Electronic Components; Electrical Insulating Synthetic Resin Materials Used For Electrical Insulating Materials Installed In An Interlayer Of Build-up Boards For Use In The Process Of Producing Build-up Boards; Electrical Insulating Synthetic Resin Materials Used For Electrical Insulating Materials Installed In An Interlayer Of Electronic Components For Sealing Electronic Components; Electrical Insulating Synthetic Resin Materials Used For Electrical Insulating Materials Installed In An Interlayer Of A Dry Film For Use In The Process Of Producing Build-up Boards; Electrical Insulating Synthetic Resin Materials Used For Electrical Insulating Materials Installed In An Interlayer Of A Dry Film For Sealing Electronic Components; Electrical Insulating Materials, Namely, Insulating Coating Materials For Use In The Process Of Producing Printed Circuit Boards; Electrical Insulating Materials, Namely, Insulating Coating Materials For Use In The Process Of Producing Display Panels; Electrical Insulating Materials, Namely, Insulating Coating Materials For Copper Foil Protection Of Surface Of Printed Circuit Boards; Electrical Insulating Materials, Namely, Insulating Coating Materials For Use In The Process Of Producing Package Circuit Boards; Electrical Insulating Materials, Namely, Insulating Coating Materials For Use In The Process Of Producing Flexible Printed Circuit Boards; Insulating Fillers, Namely, Electrical Insulating Materials For Copper Foil Protection Of Holes Of Printed Circuit Boards; Electrical Insulating Materials For Sealing Electronic Components In The Process Of Producing Printed Circuit Boards; Electrical Insulating Materials Made Of Synthetic Resin For Sealing Electronic Components In The Process Of Producing Printed Circuit Boards; Electrical Insulating Materials; Semi-processed Plastics.